Werner Wirth Systems GmbH

Potting procedures are perfect solutions for casing or complete modules, which are employed under tough environmental conditions. The melting procedure - a new and distinctly environmentally friendly coating in the use of thermoplastic materials - also ensures excellent adhesion in case of rapid temperature change.

For potting and melting we have the tried-and-tested BECTRON® potting materials, based on 2K polyurethane, polybutadiene, epoxide or silicon within the program. This diverse range of materials fulfils all requirements for the demanding protection of electronic devices and components - including important attributes such as adhesion and flexibility.

Adjusted viscosity and rapid hardening procedures ensure the economic efficiency of your production process. Environmental friendliness in production and application is naturally assured.

Examples of application

• Sensor capping
• Capping as visual or mechanical protection of complete devices
• Special protection of components for use in ATEX or offshore applications